Eidos will be present at the Interpack 2011 Trade Fair (Hall 5- STAND 5G 02), with all the products. The company is also pleased to be able to present the new SWING T2 (photo 1), a transversal "multitrack" printer for direct coding on packaging films that can be mounted on thermoforming and thermosealing machines. The features of this innovative printer are really unique. The printer is extremely compact and, moreover, it has a very competitive price. That's why this new device is already proving to be an ideal solution to replace mechanical date printers, which are to these days made obsolete by the advantages and flexibility benefits provided by electronics. SWING T2 is entirely cased inside a stainless steel housing, therefore it is perfect for those industrial environment where humidity, water or dust splashes and sudden changes in temperature are an issue. SWING T2 is well protected by its shell, which reduces the chances of damaging, and simplifies sanitisation operations. The machine electronics (which are also available in stainless steel) come standardised with sensible Touch Screen technology. SWING T2 delivers high-quality printing of bar codes, logos and pictures on every kind of packaging films.
At the Trade Fair, EIDOS will also present CODITHERM (photo 3), a unique printer featuring a patent-owned printing method allowing for direct printing on objects without using any cliché; the system also provides users with the opportunity to change the data set at each new repetition.
The presentation staff will also introduce STARCODE 7 (photo 4), a patent-owned software package for the control and supervision of printers' workflows, and PRINTESS (photo 5), our well-known “print&apply” system, which allows for labelling under every condition. EIDOS S.p.A. is renowned for its excellent technological standards and truly represents “Made in Italy” at its finest. The company designs and constructs its own systems and operates in Europe and extra CEE countries through its network of distributors.
Eidos at Interpack 2011:
Hall 5 Booth G02